Low Pressure Drop Custom CNC Machined Liquid Cold Plate for Data Center & Industrial Equipment

Designed for high-demand thermal management scenarios, this custom CNC machined liquid cold plate features fully customizable internal channel structures—including optional micro-channel, serpentine path, or split-flow designs—achieved through precision CNC machining, which enables low pressure drop while maintaining high heat dissipation efficiency. Compared with traditional air cooling, it delivers 10-50 times higher thermal conductivity, making it an ideal customizable heat solution for high-power density applications. The body is made of customizable high-strength aluminum alloy, which can be treated with quenching and tempering (customizable based on durability needs) to enhance structural stability and corrosion resistance, suitable for long-term use in harsh industrial environments and data centers. It supports seamless integration with various cooling systems, with customizable inlet and outlet ports to fit your equipment, compatible with data center server CPUs, industrial power modules, and other high-heat components. The modular and customizable design ensures strong scalability for different equipment sizes, balancing performance and practicality. Widely used in data centers, industrial automation, and power electronics fields, it can be tailored to your exact dimensional and performance requirements.

Our customizable CNC liquid cold plates are widely applied in various high-demand fields that require efficient thermal management, with fully tailored designs to match the unique needs of each industry. The key application scenarios include:

Industrial Electronics: Suitable for industrial inverters, power modules, industrial control systems, and medium-power electronic components, providing reliable heat dissipation to ensure stable operation in harsh industrial environments.

Data Centers & High-End Computing: Ideal for AI servers, TPU/GPU clusters, Google TPU pods, and high-end computing facilities, effectively handling ultra-high power consumption and solving chip hotspot heat dissipation issues.

Automotive (EV): Specifically designed for EV battery packs and high-power semiconductors in electric vehicles, ensuring uniform temperature distribution to extend battery life and maintain stable performance of automotive electronic components.

Aerospace : Adaptable to extreme environments, applied in aerospace electronic equipment, with customizable pressure and temperature resistance to withstand severe temperature changes, shock, and vibration.

General Electronics & LED Lighting: Suitable for general electronic equipment, LED lighting systems, and power supplies, offering cost-effective and customizable thermal management solutions with low noise and easy installation.

Packed in a thick corrugated carton, with foam pads placed around the carton to enhance shock resistance during transportation